• DocumentCode
    3762349
  • Title

    Engineering the performance of metal/insulator/metal devices with ALD nanolaminate insulators

  • Author

    John F. Conley

  • Author_Institution
    School of EECS, Oregon State University, Corvallis, United States
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Thin film metal-insulator-metal (MIM) devices find application not only as back-end-of-line (BEOL) capacitors (MIMCAPs), but also as tunnel diodes for optical rectenna based IR energy harvesting, IR detectors, large area macroelectronics, hot electron transistors, and as selector devices to avoid sneak leakage in resistive memory (RRAM) crossbar arrays. This invited talk will highlight how nanolaminate combinations of insulators deposited via atomic layer deposition (ALD) can be used to enhance the performance of MIIM diodes and MIIM capacitors as well as discuss reliability issues.
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop (IIRW), 2015 IEEE International
  • Print_ISBN
    978-1-4673-7395-1
  • Electronic_ISBN
    2374-8036
  • Type

    conf

  • DOI
    10.1109/IIRW.2015.7437054
  • Filename
    7437054