• DocumentCode
    3762368
  • Title

    Influence of MOSFET geometry on the statistical distribution of NBTI induced parameter degradation

  • Author

    Christian Schl?nder;Fabian Proebster;J?rg Berthold;Wolfgang Gustin;Hans Reisinger

  • Author_Institution
    Corporate Reliability Department, Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany
  • fYear
    2015
  • Firstpage
    81
  • Lastpage
    86
  • Abstract
    NBTI parameter degradation of MOSFETs shows a statistical variation. The distribution of the threshold voltage Vth after NBTI stress originates from a convolution of the distribution of the virgin devices together with the additional distribution of the NBTI degradation itself. The variability of the Vth (and other electrical parameters) of the virgin devices bases on process induced fluctuations of dopant atoms, oxide thickness, channel length, etc. The dependence on the transistor size is proven by several publications [e.g. 1,2]. The variability of the NBTI parameter degradation itself and the convolution is not fully understood yet and need further investigation. In this paper we investigate the dependency of the NBTI variability of Vth on the transistor size and geometry. For the necessary statistical relevance we perform NBTI stress experiments with the help of a smart array test-structure at a large amount of pMOS devices with various geometries. We show that the variability of pMOSFETs after NBTI depends not only on the size of the active area (w×l) but also on its geometry (w/l).
  • Keywords
    "Stress","Degradation","Geometry","Standards","MOSFET","Threshold voltage"
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop (IIRW), 2015 IEEE International
  • Print_ISBN
    978-1-4673-7395-1
  • Electronic_ISBN
    2374-8036
  • Type

    conf

  • DOI
    10.1109/IIRW.2015.7437073
  • Filename
    7437073