• DocumentCode
    3769701
  • Title

    Improved electrical properties of electronic packaging based on epoxypolybutadiene resin

  • Author

    Christian W. Johnston;Donald F. Stackhouse

  • Author_Institution
    FMC Corporation, P. O. Box 8, Princeton, New Jersey
  • fYear
    1962
  • Firstpage
    154
  • Lastpage
    156
  • Abstract
    In the past year a new class of epoxy resins has come onto the market. These resins which go under the name of Oxiron® are epoxidized polybutadienes. In addition to having the oxirane oxygen groups, they also possess unsaturation and therefore the methods of curing them can be quite diverse. The great versatility of this resin has been discussed in previous papers(1, 2, 3, 4) as well as its application to specific end uses such as laminates(5). At the present time we propose discussing the use of these resins for electronic packaging.
  • Keywords
    "Compounds","Resins","Frequency measurement","Resistance","Q measurement","Temperature","Heating"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference Materials and Application, 1962. EIC 1962. EI
  • Print_ISBN
    978-1-5090-3103-0
  • Type

    conf

  • DOI
    10.1109/EIC.1962.7456070
  • Filename
    7456070