DocumentCode
3769701
Title
Improved electrical properties of electronic packaging based on epoxypolybutadiene resin
Author
Christian W. Johnston;Donald F. Stackhouse
Author_Institution
FMC Corporation, P. O. Box 8, Princeton, New Jersey
fYear
1962
Firstpage
154
Lastpage
156
Abstract
In the past year a new class of epoxy resins has come onto the market. These resins which go under the name of Oxiron® are epoxidized polybutadienes. In addition to having the oxirane oxygen groups, they also possess unsaturation and therefore the methods of curing them can be quite diverse. The great versatility of this resin has been discussed in previous papers(1, 2, 3, 4) as well as its application to specific end uses such as laminates(5). At the present time we propose discussing the use of these resins for electronic packaging.
Keywords
"Compounds","Resins","Frequency measurement","Resistance","Q measurement","Temperature","Heating"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference Materials and Application, 1962. EIC 1962. EI
Print_ISBN
978-1-5090-3103-0
Type
conf
DOI
10.1109/EIC.1962.7456070
Filename
7456070
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