DocumentCode
3769736
Title
Compatibility of wire enamels with epoxy encapsulants
Author
D. C. Westervelt;E. J. Croop
Author_Institution
Westinghouse Research Laboratories, Pittsburgh, Pennsylvania
fYear
1968
Firstpage
75
Lastpage
79
Abstract
Epoxy impregnants are being used in many applications for the environmental protection of magnet coils in motors, transformers, solenoids and reactors, and even for completed electronic circuit functional blocks. The physical properties of the epoxy resin compounds used are ideally suited, in most cases, for this purpose. These properties may be varied from rigid to flexible, transparent to opaque, and from high to low impregnating viscosity. They may also be formulated to specific degrees of toughness, impact resistance, low shrinkage, high moisture resistance, and superior resistance to a host of solvents and chemicals, notably alkalies. With a proper formulation, it is possible to apply an epoxy compound by molding, casting, dipping, vacuum impregnating or even spraying. Thus, their properties may be tailored to fit a greater variety of applications than the more widely used and less expensive impregnating varnishes.
Keywords
"Wires","Thermal stability","Compounds","Boron","Epoxy resins","Resistance","Aging"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1968 8th
Print_ISBN
978-1-5090-3107-8
Type
conf
DOI
10.1109/EIC.1968.7456107
Filename
7456107
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