• DocumentCode
    3769741
  • Title

    Future of high temperature electrical pressure-sensitive adhesive tape

  • Author

    Raymond T. Hsu

  • Author_Institution
    Permacel
  • fYear
    1968
  • Firstpage
    89
  • Lastpage
    90
  • Abstract
    Reduction in component size and higher ambient temperature conditions are two of the main causes of increased thermal stresses placed upon electrical insulation materials. By virtue of its simplicity in use, pressure-sensitive adhesive (PSA) tape offers the end user economy, versatility, and speed. Although PSA tape constitutes only one component of an insulation system, its ability to operate effectively at the elevated temperatures will determine, along with the other components, the life of the system. The development and introduction of new insulation materials effectively increases the ability of PSA tapes to meet the challenge of higher temperature demands. For this discussion, high temperature is defined as Class 155 and above.
  • Keywords
    "Insulation","Substrates","Wires","Resistance","Coatings","Polymers","Stress"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1968 8th
  • Print_ISBN
    978-1-5090-3107-8
  • Type

    conf

  • DOI
    10.1109/EIC.1968.7456112
  • Filename
    7456112