• DocumentCode
    37703
  • Title

    Parallel Averaging for Thermal Noise Mitigation in MEMS Electrothermal Displacement Sensors

  • Author

    Mohammadi, Ali ; Moheimani, S.O.R. ; Yuce, Mehmet Rasit

  • Author_Institution
    Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Clayton, VIC, Australia
  • Volume
    24
  • Issue
    1
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    4
  • Lastpage
    6
  • Abstract
    The sensitivity of an electrothermal displacement sensor increases with its temperature, whereas a higher temperature range leads to higher thermal noise level, which imposes a tradeoff on the sensor´s achievable resolution. We have developed a multiple sensor displacement measurement technique on a 1-degree-of-freedom silicon-on-insulator microelectromechanical systems nanopositioner that mitigates the mentioned tradeoff. To obtain maximum improvement, it is necessary to supply equal power to all of the sensors to ensure equal sensitivity. By combining three identical sensors, we have successfully achieved a 4-dB improvement in signal-to-noise ratio, which is in a good agreement with the averaging theory. Experiments show that the displacement resolution is improved from 0.3 to 0.15 nm/√(Hz) in the prototype nanopositioner. Furthermore, improvement is possible by increasing the number of sensors around the stage.
  • Keywords
    displacement measurement; microsensors; nanopositioning; nanosensors; silicon-on-insulator; thermal noise; MEMS electrothermal displacement sensor; degree-of-freedom; microelectromechanical systems nanopositioner; parallel averaging theory; prototype nanopositioner; sensor displacement measurement technique; signal-to-noise ratio; silicon-on-insulator; thermal noise level mitigation; Nanopositioning; Noise; Sensor phenomena and characterization; Temperature sensors; Thermal noise; Electrothermal sensor; averaging; averaging, nanopositioning; microelectromechanical systems (MEMS); nanopositioning; thermal noise;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2364588
  • Filename
    6954426