• DocumentCode
    3770468
  • Title

    Polyimide materials evaluation

  • Author

    Paul Bednar

  • Author_Institution
    IBM Corp. Federal Systems Division, Owego, New York 13827, USA
  • fYear
    1975
  • Firstpage
    7
  • Lastpage
    10
  • Abstract
    Addition cure polyimide materials made from Kerimid 601 resin are easily fabricated into multilayer boards using processes and equipment normally intended for epoxy boards.
  • Keywords
    "Glass","Polyimides","Laminates","Copper","Nonhomogeneous media","Resins","Resists"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1975 EIC 12th
  • Print_ISBN
    978-1-5090-3111-5
  • Type

    conf

  • DOI
    10.1109/EIC.1975.7458478
  • Filename
    7458478
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3770468