• DocumentCode
    3770470
  • Title

    Photosensitive dry film solder mask

  • Author

    Roger N. Brummel;Lyle R. Wallig

  • Author_Institution
    DuPont Company, Riston®
  • fYear
    1975
  • Firstpage
    15
  • Lastpage
    18
  • Abstract
    The new photopolymer solder mask described here combines the properties of photographic selectivity, mechanical strength, and ease of reproducible application. It provides improved circuit protection during soldering operations and subsequent handling. The new solder mask offers substantial cost and performance advantages over screened masks to designers, printed wiring board fabricators, component assemblers, and end users.
  • Keywords
    "Films","Resists","Soldering","Wiring","Conductors","Lamination","Surface treatment"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1975 EIC 12th
  • Print_ISBN
    978-1-5090-3111-5
  • Type

    conf

  • DOI
    10.1109/EIC.1975.7458480
  • Filename
    7458480
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3770470