DocumentCode :
3770470
Title :
Photosensitive dry film solder mask
Author :
Roger N. Brummel;Lyle R. Wallig
Author_Institution :
DuPont Company, Riston®
fYear :
1975
Firstpage :
15
Lastpage :
18
Abstract :
The new photopolymer solder mask described here combines the properties of photographic selectivity, mechanical strength, and ease of reproducible application. It provides improved circuit protection during soldering operations and subsequent handling. The new solder mask offers substantial cost and performance advantages over screened masks to designers, printed wiring board fabricators, component assemblers, and end users.
Keywords :
"Films","Resists","Soldering","Wiring","Conductors","Lamination","Surface treatment"
Publisher :
ieee
Conference_Titel :
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN :
978-1-5090-3111-5
Type :
conf
DOI :
10.1109/EIC.1975.7458480
Filename :
7458480
Link To Document :
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