DocumentCode
3770474
Title
A hydrostatic model of solder fillets Part II: Two dimensional model and its application to square wire wrap terminals
Author
T. Y. Chu
Author_Institution
Thermal Energy Studies, Engineering Research Center, Western Electric Company, Princeton, N. J. 08540, USA
fYear
1975
Firstpage
32
Lastpage
36
Abstract
A model for axisymmetric solder fillets is presented in Part I (1). Another general class of configuration is the two dimensional fillet such as the fillets formed by a terminal pin laying on a flat land area or a “Tee” joint. The model is also extended to calculate the fillets formed between a square wire wrap terminal and the land areas of a plated-through-hole (PTH). The application of these results to the design of a wire wrap terminal and the choices of preform sizes is also discussed.
Keywords
"Mathematical model","Shape","Force","Wires","Preforms","Surface tension","Market research"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN
978-1-5090-3111-5
Type
conf
DOI
10.1109/EIC.1975.7458484
Filename
7458484
Link To Document