• DocumentCode
    3770476
  • Title

    Unique reliability characteristics of multiwire™ interconnection boards compared to multilayer printed circuits

  • Author

    Joseph P. Hammond

  • Author_Institution
    Photocircuits Division, Kollmorgen Corp., Glen Cove, New York, USA
  • fYear
    1975
  • Firstpage
    40
  • Lastpage
    44
  • Abstract
    Test data and field experience have shown that the Multiwire technology as compared to multilayer technology provides a means of achieving high connectivity with equally high reliability.
  • Keywords
    "Wires","Integrated circuit interconnections","Nonhomogeneous media","Reliability","Conductors","Copper","Thermal expansion"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1975 EIC 12th
  • Print_ISBN
    978-1-5090-3111-5
  • Type

    conf

  • DOI
    10.1109/EIC.1975.7458486
  • Filename
    7458486
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3770476