Title :
Unique reliability characteristics of multiwire™ interconnection boards compared to multilayer printed circuits
Author :
Joseph P. Hammond
Author_Institution :
Photocircuits Division, Kollmorgen Corp., Glen Cove, New York, USA
Abstract :
Test data and field experience have shown that the Multiwire technology as compared to multilayer technology provides a means of achieving high connectivity with equally high reliability.
Keywords :
"Wires","Integrated circuit interconnections","Nonhomogeneous media","Reliability","Conductors","Copper","Thermal expansion"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN :
978-1-5090-3111-5
DOI :
10.1109/EIC.1975.7458486
