• DocumentCode
    3770483
  • Title

    Reliability considerations in the application of plastic semiconductors

  • Author

    E. B. Hakim

  • Author_Institution
    U. S. Army Electronics Command, Electronic Technology and Devices Laboratory, Fort Monmouth, New Jersey 07703, USA
  • fYear
    1975
  • Firstpage
    68
  • Lastpage
    68
  • Abstract
    Extensive reliability evaluation of plastic encapsulated transistors and microcircuits at Fort Monmouth and by vendors and commercial users of these devices, has revealed at least three major problem areas: 1. Bond Integrity 2. Moisture Resistance 3. Salt Atmosphere Sensitivity
  • Keywords
    "Plastics","Transistors","Integrated circuit reliability","Semiconductor diodes","Gold"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1975 EIC 12th
  • Print_ISBN
    978-1-5090-3111-5
  • Type

    conf

  • DOI
    10.1109/EIC.1975.7458493
  • Filename
    7458493
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3770483