DocumentCode :
3770492
Title :
An overview of silicone dielectric gels
Author :
Daryl D. Dickson
Author_Institution :
Dow Corning Corporation, Midland, Michigan, USA
fYear :
1975
Firstpage :
92
Lastpage :
95
Abstract :
Although silicone dielectric gels have been employed in microcircuit packaging applications for more than a decade, there has been a lack of information in the literature to aid a potential user. This report provides an overview of how silicone dielectric gels are used, with special emphasis on quality control test procedures and cure system limitations.
Keywords :
"Dielectrics","Rubber","Substrates","Resins","Heating","Chemicals","Production"
Publisher :
ieee
Conference_Titel :
Electrical/Electronics Insulation Conference, 1975 EIC 12th
Print_ISBN :
978-1-5090-3111-5
Type :
conf
DOI :
10.1109/EIC.1975.7458502
Filename :
7458502
Link To Document :
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