Title :
Electrical evaluation of conductive adhesives
Author :
K. F. Schoch;A. I. Bennett
Author_Institution :
Dielectrics and Insulation Department, Westinghouse Research and Development Center, Pittsburgh, PA 15235, USA
Abstract :
The resistivity of several metal-filled adhesives was followed over a frequency range of 1 KHz to 10 MHz. The resistivity of the cured resins increased according to the filler in the order: Ag < Cu < Ni. The resistivity of most of the materials were independent of frequency over the range investigated. The exceptions were the two least conductive materials which decreased in resistivity between 1 MHz and 10 MHz. In addition, the shear strenghts of the adhesives were measured according to ASTM Dl002 on copper surfaces.
Keywords :
"Conductivity","Resistance","Nickel","Resins","Compounds","Conductive adhesives"
Conference_Titel :
Electrical/Electronics Insulation Conference, 1985 EIC 17th
Print_ISBN :
978-1-5090-3115-3
DOI :
10.1109/EIC.1985.7458627
