DocumentCode :
3771021
Title :
High speed encapsulation using liquid injection molding with thermosetting silicone elastomers
Author :
Randy J. McDonald
Author_Institution :
Dow Corning Corporation, Midland, Michigan, USA
fYear :
1971
Firstpage :
81
Lastpage :
85
Abstract :
Liquid injection molding with thermosetting silicone elastomers offers the following advantages: 1. High speed encapsulation yielding higher production rates, lower unit cost and increased profits 2. Low capital expenditure for evaluation of the process and the molds 3. Excellent dielectric, physical, and thermal properties to provide stabilization for the device even when exposed to adverse conditions.
Keywords :
"Liquids","Injection molding","Presses","Viscosity","Insulators","Clamps","Vents"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1971 EIC 10th
Print_ISBN :
978-1-5090-3116-0
Type :
conf
DOI :
10.1109/EIC.1971.7460776
Filename :
7460776
Link To Document :
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