DocumentCode :
3771025
Title :
Processing of liquid epoxy for transfer molding
Author :
H. B. Heinzen
Author_Institution :
Epic Resins, Division of RTE Corporation, Waukesha, Wisconsin, USA
fYear :
1971
Firstpage :
93
Lastpage :
95
Abstract :
Liquid Epoxy is now being specified for production parts. These parts are being tooled for manufacture on standard encapsulating presses, using standard press feeding equipment (TTPI and TTP2).
Keywords :
"Liquids","Presses","Resins","Standards","Thermal stability","Temperature measurement"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1971 EIC 10th
Print_ISBN :
978-1-5090-3116-0
Type :
conf
DOI :
10.1109/EIC.1971.7460780
Filename :
7460780
Link To Document :
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