• DocumentCode
    3771025
  • Title

    Processing of liquid epoxy for transfer molding

  • Author

    H. B. Heinzen

  • Author_Institution
    Epic Resins, Division of RTE Corporation, Waukesha, Wisconsin, USA
  • fYear
    1971
  • Firstpage
    93
  • Lastpage
    95
  • Abstract
    Liquid Epoxy is now being specified for production parts. These parts are being tooled for manufacture on standard encapsulating presses, using standard press feeding equipment (TTPI and TTP2).
  • Keywords
    "Liquids","Presses","Resins","Standards","Thermal stability","Temperature measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1971 EIC 10th
  • Print_ISBN
    978-1-5090-3116-0
  • Type

    conf

  • DOI
    10.1109/EIC.1971.7460780
  • Filename
    7460780
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3771025