Title :
The development of improved poly imide flexible printed circuits
Author_Institution :
Martin Marietta Corporation, Orlando, Florida, USA
Abstract :
Through perseverance and ingenuity, the problems of fabricating all-polyimide flexible printed wiring harnesses have been overcome. End requirements were such that no lesser product would do. For many applications, however, high-temperature bond strength, or high-inter laminar bond strength or other extreme .requirements may not be considerations.
Keywords :
"Films","Polyimides","Bonding","Copper","Surface resistance","Stress"
Conference_Titel :
Electrical Insulation Conference, 1971 EIC 10th
Print_ISBN :
978-1-5090-3116-0
DOI :
10.1109/EIC.1971.7460802