• DocumentCode
    3771047
  • Title

    The development of improved poly imide flexible printed circuits

  • Author

    W. S. Rigling

  • Author_Institution
    Martin Marietta Corporation, Orlando, Florida, USA
  • fYear
    1971
  • Firstpage
    163
  • Lastpage
    165
  • Abstract
    Through perseverance and ingenuity, the problems of fabricating all-polyimide flexible printed wiring harnesses have been overcome. End requirements were such that no lesser product would do. For many applications, however, high-temperature bond strength, or high-inter laminar bond strength or other extreme .requirements may not be considerations.
  • Keywords
    "Films","Polyimides","Bonding","Copper","Surface resistance","Stress"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1971 EIC 10th
  • Print_ISBN
    978-1-5090-3116-0
  • Type

    conf

  • DOI
    10.1109/EIC.1971.7460802
  • Filename
    7460802