DocumentCode
3771047
Title
The development of improved poly imide flexible printed circuits
Author
W. S. Rigling
Author_Institution
Martin Marietta Corporation, Orlando, Florida, USA
fYear
1971
Firstpage
163
Lastpage
165
Abstract
Through perseverance and ingenuity, the problems of fabricating all-polyimide flexible printed wiring harnesses have been overcome. End requirements were such that no lesser product would do. For many applications, however, high-temperature bond strength, or high-inter laminar bond strength or other extreme .requirements may not be considerations.
Keywords
"Films","Polyimides","Bonding","Copper","Surface resistance","Stress"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1971 EIC 10th
Print_ISBN
978-1-5090-3116-0
Type
conf
DOI
10.1109/EIC.1971.7460802
Filename
7460802
Link To Document