Low molecular weight butyl insulation compounds

The need for potting and encapsulation compounds which, in addition to possessing excellent electrical properties, are stable to the environment is well known. The new low molecular weight butyl, Butyl LM, appears to fill this need. The properties of Butyl LM described in this paper include: Excellent initial electrical properties. Electrical properties stable over a broad range of temperature, frequency and aging conditions. No hydrolysis in high temperature-high humidity conditions. The lowest water vapor transmission rate of any elastomeric potting compound. No curing exotherm.