DocumentCode
3771052
Title
Dimensional stability of stripline materials
Author
Edward M. Petrie;Robert Grove
Author_Institution
Westinghouse Research Laboratories, Pittsburgh, Pennsylvania, USA
fYear
1971
Firstpage
179
Lastpage
183
Abstract
A pre-etch thermal shock treatment effectively stabilized ⅛" stripline boards of irradiated polyethylene clad with 1 oz/sq ft copper. No evaluations have been completed regarding the effect of this process on other thicknesses or dielectrics. However, it is expected that the experimental procedure used for determining the proper treating cycle may be applicable to all thermoplastic stripline boards. Such processing would add to the cost of a finished microwave circuit, but when balanced against the higher price and weight of reinforced materials and potential failure of unstable circuits, the economics of a stabilizing treatment prove inviting.
Keywords
"Stripline","Aging","Dielectrics","Thermal stability","Annealing","Temperature measurement","Copper"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1971 EIC 10th
Print_ISBN
978-1-5090-3116-0
Type
conf
DOI
10.1109/EIC.1971.7460807
Filename
7460807
Link To Document