Continuous Powder Coating Encapsulation process

Powder Coating Encapsulation of electronic components has evolved as a real production technique in Europe, Japan and the U.S., over the last three years. This has been made possible by the development of low fusion temperature powder coatings at Hysol Division Dexter, and the development of coating equipment for axial and radial lead components. There are a number of significant advantages over earlier encapsulation methods.