• DocumentCode
    3771138
  • Title

    The use of dielectric analysis to study the cure of an epoxy casting compound

  • Author

    Z. N. Sanjana;R. L. Selby

  • Author_Institution
    Westinghouse R&D Center, Pittsburgh, PA 15235, USA
  • fYear
    1979
  • Firstpage
    119
  • Lastpage
    122
  • Abstract
    This paper presents the results of a study in which dielectric analysis was used to optimize catalyst concentration and minimize mold cycle time for an epoxy casting compound. The casting compound used was based on an anhydride cured hydantoin epoxy resin. Increasing the catalyst concentration to reduce mold time results in a reduced pot life. Using dielectric analysis, gel times and cure times were determined for several catalyst concentrations. Arrhenius plots for the gel times were obtained and minimum cure times for an optimum formulation were determined. The method described here is of general application and may be used to optimize formulations and cure cycles for many polymer processes.
  • Keywords
    "Compounds","Temperature measurement","Casting","Temperature","Dielectrics","Resins","Isothermal processes"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1979 EIC 14th
  • Print_ISBN
    978-1-5090-3113-9
  • Type

    conf

  • DOI
    10.1109/EIC.1979.7461101
  • Filename
    7461101