DocumentCode
3771138
Title
The use of dielectric analysis to study the cure of an epoxy casting compound
Author
Z. N. Sanjana;R. L. Selby
Author_Institution
Westinghouse R&D Center, Pittsburgh, PA 15235, USA
fYear
1979
Firstpage
119
Lastpage
122
Abstract
This paper presents the results of a study in which dielectric analysis was used to optimize catalyst concentration and minimize mold cycle time for an epoxy casting compound. The casting compound used was based on an anhydride cured hydantoin epoxy resin. Increasing the catalyst concentration to reduce mold time results in a reduced pot life. Using dielectric analysis, gel times and cure times were determined for several catalyst concentrations. Arrhenius plots for the gel times were obtained and minimum cure times for an optimum formulation were determined. The method described here is of general application and may be used to optimize formulations and cure cycles for many polymer processes.
Keywords
"Compounds","Temperature measurement","Casting","Temperature","Dielectrics","Resins","Isothermal processes"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN
978-1-5090-3113-9
Type
conf
DOI
10.1109/EIC.1979.7461101
Filename
7461101
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