DocumentCode
3771139
Title
Resin thermal analysis
Author
R. K. Khattak;E. E. Woods
Author_Institution
Westinghouse Electric Corporation, 469 Sharpsville Avenue, Sharon, Pennsylvania 16146, USA
fYear
1979
Firstpage
123
Lastpage
127
Abstract
Thermomechanical Analysis Technology was used as a means of establishing a molding cycle for the manufacture of resin insulated bushings. The degree of cure of the resin system used in the molding process was found to be significantly different when heated vs unheated conductors were used. The glass transition temperature (Tg) was used to determine the degree of cure of the resin system and the coefficient of thermal expansion (?) of the resin was used as a guideline for choosing the appropriate molding cycle time best suited for economical production of the molded bushings.
Keywords
"Conductors","Insulators","Heating","Glass","Thermomechanical processes","Epoxy resins"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1979 EIC 14th
Print_ISBN
978-1-5090-3113-9
Type
conf
DOI
10.1109/EIC.1979.7461102
Filename
7461102
Link To Document