• DocumentCode
    3771139
  • Title

    Resin thermal analysis

  • Author

    R. K. Khattak;E. E. Woods

  • Author_Institution
    Westinghouse Electric Corporation, 469 Sharpsville Avenue, Sharon, Pennsylvania 16146, USA
  • fYear
    1979
  • Firstpage
    123
  • Lastpage
    127
  • Abstract
    Thermomechanical Analysis Technology was used as a means of establishing a molding cycle for the manufacture of resin insulated bushings. The degree of cure of the resin system used in the molding process was found to be significantly different when heated vs unheated conductors were used. The glass transition temperature (Tg) was used to determine the degree of cure of the resin system and the coefficient of thermal expansion (?) of the resin was used as a guideline for choosing the appropriate molding cycle time best suited for economical production of the molded bushings.
  • Keywords
    "Conductors","Insulators","Heating","Glass","Thermomechanical processes","Epoxy resins"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1979 EIC 14th
  • Print_ISBN
    978-1-5090-3113-9
  • Type

    conf

  • DOI
    10.1109/EIC.1979.7461102
  • Filename
    7461102