• DocumentCode
    3771176
  • Title

    Epoxy resins for molding application

  • Author

    D. Helfand;T. Villani

  • Author_Institution
    CIBA-GEIGY Corporation, USA
  • fYear
    1979
  • Firstpage
    290
  • Lastpage
    297
  • Abstract
    Epoxy resins offer many advantages over other resin types for the encapsulation of active semi conductor devices. Of particular importance in this area are the epoxy cresol novolacs.
  • Keywords
    "Compounds","Epoxy resins","Solids","Manganese","Chromatic dispersion","Thermal conductivity"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1979 EIC 14th
  • Print_ISBN
    978-1-5090-3113-9
  • Type

    conf

  • DOI
    10.1109/EIC.1979.7461139
  • Filename
    7461139
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3771176