• DocumentCode
    3771207
  • Title

    The use of thin copper clad laminates in multilayer printed wiring

  • Author

    Robert L. Swiggett

  • Author_Institution
    Photocircuits Corporation, Glen Cove, New York, USA
  • fYear
    1965
  • Firstpage
    34
  • Lastpage
    36
  • Abstract
    The use of multilayer printed wiring boards is growing rapidly due primarily to the miniaturization demands of military missile and space programs and the increasingly widespread use of integrated circuits in computers and industrial equipment. Multilayers are a powerful tool for packing large numbers of interconnections into a small volume with reproducible electrical properties.
  • Keywords
    "Conductors","Nonhomogeneous media","Laminates","Copper","Integrated circuit interconnections","Insulation","Wiring"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1965 Sixth
  • Print_ISBN
    978-1-5090-3105-4
  • Type

    conf

  • DOI
    10.1109/EIC.1965.7461172
  • Filename
    7461172
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3771207