DocumentCode :
3771207
Title :
The use of thin copper clad laminates in multilayer printed wiring
Author :
Robert L. Swiggett
Author_Institution :
Photocircuits Corporation, Glen Cove, New York, USA
fYear :
1965
Firstpage :
34
Lastpage :
36
Abstract :
The use of multilayer printed wiring boards is growing rapidly due primarily to the miniaturization demands of military missile and space programs and the increasingly widespread use of integrated circuits in computers and industrial equipment. Multilayers are a powerful tool for packing large numbers of interconnections into a small volume with reproducible electrical properties.
Keywords :
"Conductors","Nonhomogeneous media","Laminates","Copper","Integrated circuit interconnections","Insulation","Wiring"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1965 Sixth
Print_ISBN :
978-1-5090-3105-4
Type :
conf
DOI :
10.1109/EIC.1965.7461172
Filename :
7461172
Link To Document :
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