• DocumentCode
    3771236
  • Title

    Materials and process for multilayer circuits

  • Author

    L. V. Larsen

  • Author_Institution
    General Electric Co., Coshocton, Ohio, USA
  • fYear
    1965
  • Firstpage
    121
  • Lastpage
    124
  • Abstract
    Although they have been in use only a few years, multilayer circuits have found a place of great importance in electronic packaging because they uniquely fill a need. Perhaps in their beginning, multilayer circuits were thought of as a convenient answer to the requirements for making connections into and within compact circuits, but today they are finding application as circuit components themselves.
  • Keywords
    "Laminates","Nonhomogeneous media","Copper","Glass","Bonding","Standards","Resins"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1965 Sixth
  • Print_ISBN
    978-1-5090-3105-4
  • Type

    conf

  • DOI
    10.1109/EIC.1965.7461201
  • Filename
    7461201