Keynote paper insulating substrates for data processing equipment

Some present developments in the area of laminated, low-loss and combined substrates for use in electronic equipment are discussed. The tailoring of these materials, particularly in light of their intended fabrication, to meet specific engineering needs is reviewed in terms of several concrete applications. Some of the properties which appear critical for the successful use of these materials are noted and used to provide insight concerning future trends in materials engineering in this area.