?The evaluation of vinylidene fluoride resin as an insulator for computer applications?

The increasing complexity and rigid requirements of the computer industry continues to outdate materials and devices developed only a few years ago. As part of this demand for increased performance in less space, the wire insulation used in computer-back panels wired with the Gardner Denver ?Wire-Wrap? machine requires greater resistance to abuse, tight tolerances, and lower cost. Because of the greater wire density of modern panels, a major troublespot has been the shorts and faults in a panel board due to insulation damage from the sharp pin edges and other mechanical parts in the back-panels of computers. This damage has occurred primarily during the hand wire wrapping operation due to wires being pushed and pulled during Engineering Change wiring. Damage is sometimes inflicted during the later life of the panel board. The incidence of these failures is best decreased by using an insulation with superior cut-through resistance and abrasion resistance.