Title :
Flame retardant synthetic fiber paper in molded circuitry
Author :
G. R. Traut;R. C. Berry;P. L. Anderson
Author_Institution :
Rogers Corporation
Abstract :
The major growth area within the printed circuit market is expected to be as a result of the development of flexible and multi-layer circuits. The continuing pressures on designers of electrical and electronic equipment for smaller and lighter packaging has greatly increased the demand for thin, multi-layer and flexible, wiring packages. In the automotive field, dashboard wiring is rapidly being replaced with flexible circuitry. Computer, appliance and meter manufacturers are among the many circuit users finding benefits in flexible multi-layer circuitry. Mechanical pattern generation methods lend themselves to the production of flexible circuits, where the insulating film to which the pattern is bonded is tough, flexible, and possesses good electrical properties.
Keywords :
"Resins","Synthetic fibers","Resistance","Copper","Insulation","Encapsulation","Flame retardants"
Conference_Titel :
Electrical Insulation Conference Materials and Application, 1963 EI
Print_ISBN :
978-1-5090-3104-7
DOI :
10.1109/EIC.1963.7461738