• DocumentCode
    3771566
  • Title

    Stress relief in insulation

  • Author

    Kurt W. Hollander

  • Author_Institution
    Westinghouse Defense and Space Center, Aerospace Division, Baltimore, Maryland
  • fYear
    1969
  • Firstpage
    80
  • Lastpage
    80
  • Abstract
    Increasing demand for compactness leads to the steadily increasing use of hard insulation, which may be a solid or a hardened liquid. The insulation thickness required to separate potentials above nominal levels generally create volume variations by expansion and contraction which may be appreciably different from that of the surrounding enclosure. This volume deviation between the insulation and its available space leads either directly to holes or "voids" or, in case of the material overflowing, to voids when earlier conditions are restored. This relative motion of the insulation can result in bending or breaking of wires or electric hardware suspended therein or to excessive potential stress when voids occur in regions already highly stressed. Restricting this volume variation to regions of low stress and segments therein carrying no component resolves the problem.
  • Keywords
    "Insulation","Stress","Electric potential","Wires","Transformer cores","Solids","Hardware"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1969 9th
  • Print_ISBN
    978-1-5090-3108-5
  • Type

    conf

  • DOI
    10.1109/EIC.1969.7461834
  • Filename
    7461834