DocumentCode
3771566
Title
Stress relief in insulation
Author
Kurt W. Hollander
Author_Institution
Westinghouse Defense and Space Center, Aerospace Division, Baltimore, Maryland
fYear
1969
Firstpage
80
Lastpage
80
Abstract
Increasing demand for compactness leads to the steadily increasing use of hard insulation, which may be a solid or a hardened liquid. The insulation thickness required to separate potentials above nominal levels generally create volume variations by expansion and contraction which may be appreciably different from that of the surrounding enclosure. This volume deviation between the insulation and its available space leads either directly to holes or "voids" or, in case of the material overflowing, to voids when earlier conditions are restored. This relative motion of the insulation can result in bending or breaking of wires or electric hardware suspended therein or to excessive potential stress when voids occur in regions already highly stressed. Restricting this volume variation to regions of low stress and segments therein carrying no component resolves the problem.
Keywords
"Insulation","Stress","Electric potential","Wires","Transformer cores","Solids","Hardware"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1969 9th
Print_ISBN
978-1-5090-3108-5
Type
conf
DOI
10.1109/EIC.1969.7461834
Filename
7461834
Link To Document