• DocumentCode
    3771579
  • Title

    Packaging and environmental studies of copper clad tfe-glass stripline

  • Author

    J. H. Ball;Murray Olyphant;K. H. Zaininger

  • Author_Institution
    Minnesota Mining and Manufacturing Co., St. Paul, Minnesota
  • fYear
    1969
  • Firstpage
    119
  • Lastpage
    121
  • Abstract
    In microwave stripline devices circuit performance is directly dependent on the effective dielectric properties of the substrate. Variations in effective substrate properties in production, after thermal shock, with varying temperature, and as a result of moisture exposure can degrade circuit performance, change frequency response, and often render circuits inoperative.
  • Keywords
    "Films","Insulators","Integrated circuits","Substrates","Physics","Surface treatment","Stripline"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1969 9th
  • Print_ISBN
    978-1-5090-3108-5
  • Type

    conf

  • DOI
    10.1109/EIC.1969.7461847
  • Filename
    7461847