DocumentCode
3771646
Title
Metallization of beryllia ceramics for microelectronic use
Author
John A. DeVore
Author_Institution
Advanced Reliability Studies, General Electric Company, Syracuse, New York
fYear
1977
Firstpage
70
Lastpage
71
Abstract
Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.
Keywords
"Substrates","Metallization","Ceramics","Surface morphology","Adhesives","Thick films"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1977 EIC 13th
Print_ISBN
978-1-5090-3112-2
Type
conf
DOI
10.1109/EIC.1977.7461916
Filename
7461916
Link To Document