• DocumentCode
    3771646
  • Title

    Metallization of beryllia ceramics for microelectronic use

  • Author

    John A. DeVore

  • Author_Institution
    Advanced Reliability Studies, General Electric Company, Syracuse, New York
  • fYear
    1977
  • Firstpage
    70
  • Lastpage
    71
  • Abstract
    Within the last decade and especially in the last two years, the use of beryllia as an electronic substrate material has risen dramatically. One reason for this has been the development of high power devices which require electrical isolation. Another reason has been the demand for high packaging densities. Both of these reflect a need to remove heat from the device efficiently.
  • Keywords
    "Substrates","Metallization","Ceramics","Surface morphology","Adhesives","Thick films"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1977 EIC 13th
  • Print_ISBN
    978-1-5090-3112-2
  • Type

    conf

  • DOI
    10.1109/EIC.1977.7461916
  • Filename
    7461916