DocumentCode
3771648
Title
Teflon®∗ stripline printed boards — Consider the thermal properties of this dielectric
Author
Thomas D. Newton
Author_Institution
Electronic Devices Division, Rockwell International, Cedar Rapids, Iowa
fYear
1977
Firstpage
75
Lastpage
79
Abstract
Teflon is a unique dielectric material. It has a dielectric constant and a loss factor that are extremely uniform for frequencies into the tens of GHz. However, some physical parameters of this material are also very sensitive to thermal environments. This paper considers some of the major thermal characteristics of Teflon, the relationships between those characteristics and the properties of plated copper, and finally the processing and design techniques which can overcome or accommodat these relationships to yield a reliable Teflon multilayer printed board.
Keywords
"Dielectrics","Copper","Plating","Stress","Nonhomogeneous media","Integrated circuit interconnections","Temperature"
Publisher
ieee
Conference_Titel
Electrical/Electronics Insulation Conference, 1977 EIC 13th
Print_ISBN
978-1-5090-3112-2
Type
conf
DOI
10.1109/EIC.1977.7461918
Filename
7461918
Link To Document