• DocumentCode
    3771648
  • Title

    Teflon®∗ stripline printed boards — Consider the thermal properties of this dielectric

  • Author

    Thomas D. Newton

  • Author_Institution
    Electronic Devices Division, Rockwell International, Cedar Rapids, Iowa
  • fYear
    1977
  • Firstpage
    75
  • Lastpage
    79
  • Abstract
    Teflon is a unique dielectric material. It has a dielectric constant and a loss factor that are extremely uniform for frequencies into the tens of GHz. However, some physical parameters of this material are also very sensitive to thermal environments. This paper considers some of the major thermal characteristics of Teflon, the relationships between those characteristics and the properties of plated copper, and finally the processing and design techniques which can overcome or accommodat these relationships to yield a reliable Teflon multilayer printed board.
  • Keywords
    "Dielectrics","Copper","Plating","Stress","Nonhomogeneous media","Integrated circuit interconnections","Temperature"
  • Publisher
    ieee
  • Conference_Titel
    Electrical/Electronics Insulation Conference, 1977 EIC 13th
  • Print_ISBN
    978-1-5090-3112-2
  • Type

    conf

  • DOI
    10.1109/EIC.1977.7461918
  • Filename
    7461918