Title :
Wireless MEMS tested within the context of a transparent sensor
Author :
Repperger, D.W. ; Soni, S.R. ; Reynolds, D.B.
Author_Institution :
AFRL/HECP, WPAFB, OH, USA
Abstract :
The attributes of being both noninvasive and wireless provide great advantages for the MEMS pressure measurement device described. By inserting a MEMS contrivance inside a composite material, the assemblage is sheltered from the surroundings yet able to operate in harsh environments, such as in outer space. Data are presented on testing of such a system in a three point bending test to failure and comparing the MEMS reading to external and standard strain gage measurements
Keywords :
dynamic testing; failure analysis; microsensors; pressure sensors; semiconductor device testing; space vehicle electronics; composite material; failure; harsh environments; outer space; pressure measurement device; three point bending test; transparent sensor; wireless MEMS; Capacitive sensors; Composite materials; Force measurement; Micromechanical devices; Pressure measurement; Sensor phenomena and characterization; Strain measurement; System testing; Temperature sensors; Wireless sensor networks;
Conference_Titel :
Circuits and Systems, 2001. MWSCAS 2001. Proceedings of the 44th IEEE 2001 Midwest Symposium on
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-7150-X
DOI :
10.1109/MWSCAS.2001.986291
