DocumentCode :
3772
Title :
Thermal Dynamical Identification of Light-Emitting Diodes by Step-Based Realization and Convex Optimization
Author :
Miller, D.N. ; Hulett, Jeff ; McLaughlin, Jim ; de Callafon, Raymond A.
Author_Institution :
Jacobs School of Engineering, University of California San Diego, La Jolla, CA, USA
Volume :
3
Issue :
6
fYear :
2013
fDate :
Jun-13
Firstpage :
997
Lastpage :
1007
Abstract :
A new method for modeling the thermal response of semiconductor devices such as light-emitting diodes (LEDs) from temperature measurements is presented. The method uses a realization-theoretic approach to identification combined with convex optimization methods. Linear matrix inequalities are constructed to guarantee that the identified discrete-time model has strictly real eigenvalues between 0 and 1, so that, when converted to continuous time, the model will have strictly real time constants. Additional optional time-domain constraints are developed to guarantee a predetermined steady-state value, guarantee no undershoot or overshoot in the transient response, and/or guarantee a positive time-constant spectrum. The method is applied to the thermal response of a high-power LED. Temperature measurements of the semiconductor device are used to model the time constants of the thermal response and characterize the relative contribution of each time constant to temperature increase. Experiments indicate how the proposed method can be used to detect thermal defects. It is shown that models with five time constants can model the thermal effects of the LEDs used with high accuracy. The proposed method is applicable to larger order systems with multiple simultaneous temperature measurements.
Keywords :
Computational modeling; Eigenvalues and eigenfunctions; Light emitting diodes; Semiconductor device measurement; Semiconductor device modeling; Time measurement; Vectors; Convex optimization; light-emitting diodes; linear-matrix inequalities; realization theory; step response; system identification; time-constant spectrum;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2229464
Filename :
6407950
Link To Document :
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