• DocumentCode
    377244
  • Title

    RF/thermal/structural analysis of the APT LEDA hot model cavity assembly

  • Author

    Schultheiss, T. ; Cole, M. ; Rathke, J. ; Wood, R. ; Krawczyk, F. ; Leslie, P. ; Schrage, D.

  • Author_Institution
    Adv. Energy Syst. Inc., Medford, NY, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    969
  • Abstract
    A three-dimensional ANSYS RF, Thermal, and Structural analysis has been performed for representative LEDA CCDTL RF structures. Geometry was taken from a Parasolid model that was generated by Los Alamos National Laboratory and represented one cavity structure. SUPERFISH results of this cavity were also provided. The ANSYS RF results were compared to SUPERFISH and to MAFIA models of the same cavity. Enough detail was used in the model to obtain heat load distributions for the coupling slot, coupling cavities, and accelerating cavities. These heat load distributions were then used as input for subsequent thermal analysis. Thermal analysis included coolant elements with heat transport capabilities and temperature dependent properties. Steady state temperature and stress distributions were determined at full field levels. Transient thermal analysis was completed to determine maximum thermal gradients and temperature distributions due to RF cycling. Structural analysis was completed to determine the locations of the model that were beyond yield strength. Plastic stress analysis from a single RF cycle was completed to determine permanent yield of the cavity
  • Keywords
    accelerator cavities; linear accelerators; proton accelerators; APT LEDA hot model cavity assembly; Parasolid model; RF cycling; SUPERFISH; accelerating cavities; coupling cavities; coupling slot; heat load distributions; heat transport capabilities; maximum thermal gradients; plastic stress analysis; steady state temperature; stress distributions; temperature dependent properties; temperature distributions; Acceleration; Geometry; Laboratories; Performance analysis; Radio frequency; Solid modeling; Temperature distribution; Thermal loading; Thermal stresses; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 2001. PAC 2001. Proceedings of the 2001
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-7191-7
  • Type

    conf

  • DOI
    10.1109/PAC.2001.986543
  • Filename
    986543