DocumentCode
3772697
Title
Thermal aspects of post-arc recovery dielectric strength of solid insulators
Author
M.N. Kaplan;A.L. Tslaf
Author_Institution
Electrical and Computer Engineering Department, Drexel University, Philadelphia, Pa. 19104, United States of America
fYear
1984
fDate
6/1/1984 12:00:00 AM
Firstpage
90
Lastpage
94
Abstract
Thermal conditions in the track of an arc on a solid insulator are analyzed from the point of view of the recovery dielectric strength. It is shown quantitatively that feedback from the arc-track can delay the recovery of the residual arc column. Relationships to estimate the temperature diffusion from the “melted” arc-track are presented. These are compared with the temperature decay in the residual arc column. The power flow into the insulation body required for thermal analysis was determined experimentally.
Keywords
"Plasma temperature","Temperature measurement","Insulators","Temperature distribution","Heating","Insulation life"
Publisher
ieee
Conference_Titel
Electrical Insulation, 1984 IEEE International Conference on
Print_ISBN
978-1-5090-3124-5
Type
conf
DOI
10.1109/EIC.1984.7465156
Filename
7465156
Link To Document