• DocumentCode
    3772697
  • Title

    Thermal aspects of post-arc recovery dielectric strength of solid insulators

  • Author

    M.N. Kaplan;A.L. Tslaf

  • Author_Institution
    Electrical and Computer Engineering Department, Drexel University, Philadelphia, Pa. 19104, United States of America
  • fYear
    1984
  • fDate
    6/1/1984 12:00:00 AM
  • Firstpage
    90
  • Lastpage
    94
  • Abstract
    Thermal conditions in the track of an arc on a solid insulator are analyzed from the point of view of the recovery dielectric strength. It is shown quantitatively that feedback from the arc-track can delay the recovery of the residual arc column. Relationships to estimate the temperature diffusion from the “melted” arc-track are presented. These are compared with the temperature decay in the residual arc column. The power flow into the insulation body required for thermal analysis was determined experimentally.
  • Keywords
    "Plasma temperature","Temperature measurement","Insulators","Temperature distribution","Heating","Insulation life"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1984 IEEE International Conference on
  • Print_ISBN
    978-1-5090-3124-5
  • Type

    conf

  • DOI
    10.1109/EIC.1984.7465156
  • Filename
    7465156