DocumentCode
3773254
Title
Micropackaging of electronic circuits
Author
R. D. Mcdonald
Author_Institution
Canada Wire and Cable Technology Development Department, Noranda Research Centre, Pointe Claire, Quebec, Canada
fYear
1973
Firstpage
192
Lastpage
193
Abstract
During the past twenty-five years since the discovery of the transistor, the development of the semiconductor device technology has been very rapid. The availability of improved devices permitted the design and fabrication of new and more complex electronic circuits and systems which required new methods for assembly of the electronic components of these circuits.
Keywords
"Substrates","Packaging","Resistors","Thick films","Integrated circuit interconnections","Production"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN
978-1-5090-3110-8
Type
conf
DOI
10.1109/EIC.1973.7468681
Filename
7468681
Link To Document