• DocumentCode
    3773254
  • Title

    Micropackaging of electronic circuits

  • Author

    R. D. Mcdonald

  • Author_Institution
    Canada Wire and Cable Technology Development Department, Noranda Research Centre, Pointe Claire, Quebec, Canada
  • fYear
    1973
  • Firstpage
    192
  • Lastpage
    193
  • Abstract
    During the past twenty-five years since the discovery of the transistor, the development of the semiconductor device technology has been very rapid. The availability of improved devices permitted the design and fabrication of new and more complex electronic circuits and systems which required new methods for assembly of the electronic components of these circuits.
  • Keywords
    "Substrates","Packaging","Resistors","Thick films","Integrated circuit interconnections","Production"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1973 EIC 11th
  • Print_ISBN
    978-1-5090-3110-8
  • Type

    conf

  • DOI
    10.1109/EIC.1973.7468681
  • Filename
    7468681