DocumentCode
3773273
Title
Electrical performance of pin-connected stacked backplanes
Author
W. H. Knausenberger
Author_Institution
Bell Laboratories, Whippany, New Jersey
fYear
1973
Firstpage
245
Lastpage
247
Abstract
Multilayer test boards have been fabricated into Stack-Assembled Multiple Multilayer (SAMM) backplane structures. Their crosstalk behavior, signal lead characteristic impedance, and the discontinuities caused by interboard vias have been characterized as a function of the separation between boards.
Keywords
"Backplanes","Crosstalk","Pins","Impedance","Inductance","Nonhomogeneous media","Lead"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN
978-1-5090-3110-8
Type
conf
DOI
10.1109/EIC.1973.7468700
Filename
7468700
Link To Document