Title :
Sand-bath and thermal-shock testing of plated-through-holes
Author_Institution :
International Business Machines Corporation, System Products Division, Endicott, New York
Abstract :
Thermal stressing of plated-through-holes (PTH) is an everyday occurrence in the manufacture of multilayer circuit cards. Thermal shock produced by manufacturing processes such as wave solder and component rework has been responsible for mechanical failures in PTH.
Keywords :
"Temperature measurement","Copper","Thermal stresses","Testing","Electric shock","Reliability","Dielectric materials"
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
DOI :
10.1109/EIC.1973.7468704
