• DocumentCode
    3773277
  • Title

    Sand-bath and thermal-shock testing of plated-through-holes

  • Author

    Robert J. Modlo

  • Author_Institution
    International Business Machines Corporation, System Products Division, Endicott, New York
  • fYear
    1973
  • Firstpage
    257
  • Lastpage
    257
  • Abstract
    Thermal stressing of plated-through-holes (PTH) is an everyday occurrence in the manufacture of multilayer circuit cards. Thermal shock produced by manufacturing processes such as wave solder and component rework has been responsible for mechanical failures in PTH.
  • Keywords
    "Temperature measurement","Copper","Thermal stresses","Testing","Electric shock","Reliability","Dielectric materials"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1973 EIC 11th
  • Print_ISBN
    978-1-5090-3110-8
  • Type

    conf

  • DOI
    10.1109/EIC.1973.7468704
  • Filename
    7468704
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3773277