Optimizing a chip adhesive

That tiny, almost invisible dot of adhesive that bonds a chip to the substrate in a microelectronic device has been a major headache to the adhesives industry. Never before has it been necessary to design so many critical properties into a single adhesive. A customer pays for and expects to receive the perfect product, an optimum chip adhesive. Unfortunately, the optimum chip adhesive had not yet been and may never be developed. Much progress toward that end has been made in the past several years and will continue. Still, perfection is not apparent. No adhesive manufacturer has yet been able to include all of the essential requirements into a single chip adhesive, without significant compromise or trade-off.