• DocumentCode
    3773369
  • Title

    Encapsulation by transfer moulding

  • Author

    Russell H. Smith

  • Author_Institution
    Hysol International, London, England
  • fYear
    1967
  • Firstpage
    208
  • Lastpage
    212
  • Abstract
    This paper is designed for the component manufacturer. It will cover some of the latest developments in the encapsulation of electronic and electrical components, using low pressure transfer moulding.
  • Keywords
    "Coils","Transistors","Capacitors","Resistance","Encapsulation","Transfer molding","Humidity"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1967 Seventh
  • Print_ISBN
    978-1-5090-3106-1
  • Type

    conf

  • DOI
    10.1109/EIC.1967.7468808
  • Filename
    7468808
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3773369