• DocumentCode
    3774583
  • Title

    3-D stacking tutorial introduction

  • Author

    Liam Madden

  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    11
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation. Presents a tutorial of three-dimensional (3D) stacking. Some of the specific topics discussed include: a description of 3D stacking technologies; design considerations; cost considerations; system implications; and future areas of development.
  • Keywords
    "Field programmable gate arrays","Stacking","Tutorials","Foundries","Mobile communication","Graphics processing units","Integrated optics"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 24 Symposium (HCS), 2012 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2012.7476470
  • Filename
    7476470
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3774583