Title :
Roadmap for design and EDA infrastructure for 3D products
Author_Institution :
Qualcomm, United States
Abstract :
This article consists of a collection of slides from the author´s conference presentation on the design and electronic design automation (EDA) infrastructure for three-dimensional mobile display products. Some of the specific topics discussed include: EDA design methodologies; options for chip design; memory capacity; evolving 3D technologies; ecosystems for 3D designs; thermal challenges; inventories of core design technologies; design environments for interposers; and the design environment for logic on logic design.
Keywords :
"Three-dimensional displays","Stacking","Random access memory","Electronic design automation","Product development","Memory management","Manufacturing processes"
Conference_Titel :
Hot Chips 24 Symposium (HCS), 2012 IEEE
DOI :
10.1109/HOTCHIPS.2012.7476473