DocumentCode :
3774587
Title :
Xilinx SSI technology concept to silicon development overview
Author :
Shankar Lakka
fYear :
2012
Firstpage :
1
Lastpage :
22
Abstract :
This article consists of a collection of slides from the author´s conference presentation. Presents the product design and applications supported by Xilinx stacked silicon interconnect (SSI) technology. Identifies the economics drivers and technical challenges the company faces to develop its SSI products/services. Discusses the progression and development of three-dimensional (3D) technolgies. Also examines capacity planning; FPGA technologies for SSI development; and future market opportunties.
Keywords :
"Silicon","Mobile communication","Three-dimensional displays","Stacking","Programmable logic","Market opportunities","Economics"
Publisher :
ieee
Conference_Titel :
Hot Chips 24 Symposium (HCS), 2012 IEEE
Type :
conf
DOI :
10.1109/HOTCHIPS.2012.7476474
Filename :
7476474
Link To Document :
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