DocumentCode :
3774589
Title :
Optical backplanes with 3D integrated photonics?
Author :
Ephrem Wu
Author_Institution :
Xilinx, United States
fYear :
2012
Firstpage :
1
Lastpage :
20
Abstract :
This article consists of a collection of slides from the author´s conference presentation on the deployment of optical backplanes with 3D integrated photonics. Some of the specific topics discussed include: a performance analysis between electrical versus optical backplanes; a comparison betwen optical systems versus optical backplane technology; and the effective deploymet of chip stacking.
Keywords :
"Backplanes","Stacking","Optical interconnections","Communication cables","Optical switches","Photonics"
Publisher :
ieee
Conference_Titel :
Hot Chips 24 Symposium (HCS), 2012 IEEE
Type :
conf
DOI :
10.1109/HOTCHIPS.2012.7476476
Filename :
7476476
Link To Document :
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