• DocumentCode
    3774589
  • Title

    Optical backplanes with 3D integrated photonics?

  • Author

    Ephrem Wu

  • Author_Institution
    Xilinx, United States
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    20
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation on the deployment of optical backplanes with 3D integrated photonics. Some of the specific topics discussed include: a performance analysis between electrical versus optical backplanes; a comparison betwen optical systems versus optical backplane technology; and the effective deploymet of chip stacking.
  • Keywords
    "Backplanes","Stacking","Optical interconnections","Communication cables","Optical switches","Photonics"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 24 Symposium (HCS), 2012 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2012.7476476
  • Filename
    7476476
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3774589