Title :
Impact of variability on power
Author_Institution :
IBM Research, Austin, USA
Abstract :
Presents a collection of slides covering the following topics: power grid noise and its variability; technology factors and design specifics; early power delivery design; packaging technology and package selection; density and distribution of routing resources; and decoupling capacitance allocation.
Keywords :
"Hip","Power dissipation","Cooling","Application specific integrated circuits","Logic gates","Market research","Leakage currents"
Conference_Titel :
Hot Chips XVII Symposium (HCS), 2005 IEEE
DOI :
10.1109/HOTCHIPS.2005.7476571
