Title :
AMD´s next generation GPU and high bandwidth memory architecture: FURY
Author_Institution :
AMD Corporate, AMD Products
Abstract :
This article consists of a collection of slides from the authors´ conference presentation. The topics discussed include: overview of AMD Radeon R9 Fury; HBM and die stacking; the journey to Fury; performance; and form factor innovation.
Keywords :
"Graphics processing units","Stacking","Through-silicon vias","Bandwidth","Silicon","DRAM chips","Memory architecture"
Conference_Titel :
Hot Chips 27 Symposium (HCS), 2015 IEEE
DOI :
10.1109/HOTCHIPS.2015.7477461
