• DocumentCode
    3775150
  • Title

    Going to the wire: The next generation financial risk management platform

  • Author

    Ari Studnitzer;Oskar Mencer

  • Author_Institution
    Platform Development, CME Group, United States
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    26
  • Abstract
    Presents a collection of slides covering the following topics: financial risk management platform; CME Group; exchange sector; financial industry; FPGA dataflow engines; multiscale dataflow computer; dataflow box programming; trading strategies; financial gateway platform; and MaxCompiler.
  • Keywords
    "Program compilers","Consumer electronics","Benchmark testing","Risk management","Technological innovation"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 25 Symposium (HCS), 2013 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2013.7478312
  • Filename
    7478312
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3775150