• DocumentCode
    3775188
  • Title

    Innovation envelope: Hot chips in blades

  • Author

    Kevin Leigh

  • Author_Institution
    BladeSystem, USA
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    19
  • Abstract
    Presents a collection of slides covering the following topics: chip innovation; blade environment; preboot configuration environment; virtual connect; and virtual Ethernet port aggregation.
  • Keywords
    "Blades","Technological innovation","System-on-chip","Computer architecture","Market opportunities","Ethernet"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 21 Symposium (HCS), 2009 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2009.7478351
  • Filename
    7478351
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3775188