Title :
The 3rd generation of IBM´s elastic interface on POWER6™
Abstract :
This article consists of a collection of slides from the author´s conference presentation on IBM´s Power6, a third generation chip. Some of the specific topics discussed include: the special features of Power6; system and architecture design; circuit approaches; testability and hardware measurements; system design guidelines and rules; and new areas of system improvement.
Keywords :
"Connectors","Backplanes","Receivers","System-on-chip","Semiconductor device measurement","System analysis and design","Flexible printed circuits"
Conference_Titel :
Hot Chips 19 Symposium (HCS), 2007 IEEE
DOI :
10.1109/HOTCHIPS.2007.7482489
