• DocumentCode
    3775653
  • Title

    The 3rd generation of IBM´s elastic interface on POWER6™

  • Author

    Daniel Dreps

  • fYear
    2007
  • Firstpage
    1
  • Lastpage
    16
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation on IBM´s Power6, a third generation chip. Some of the specific topics discussed include: the special features of Power6; system and architecture design; circuit approaches; testability and hardware measurements; system design guidelines and rules; and new areas of system improvement.
  • Keywords
    "Connectors","Backplanes","Receivers","System-on-chip","Semiconductor device measurement","System analysis and design","Flexible printed circuits"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 19 Symposium (HCS), 2007 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2007.7482489
  • Filename
    7482489
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3775653