Abstract :
With the development of electronic technology, a large amount of electronic components can be installed on PCB, which have attracted more and more attentions from researchers to the vibration performance of electronic components and PCB. In this paper, firstly, the basic theory of substructure modal analysis method was introduced, and the main effect factor for modal analysis was analyzed by theoretical method and the error equation was deduced by nonlinear matrix perturbation method. Then, the FEM analysis of electronic components and PCB with plate and solid elements were performed to discuss the influences of element order of master DOF on errors. The results show that element order of master DOF of contact pair is main factor for computational errors, including high element order of master DOF can reflect the vibration performance of PCB more accurately, and the grid number, computation time are substantially reduced compared with the overall model. Therefore, the results are valuable to engineering application.
